New 3D thermal cloak hides objects from heat in any direction
Researchers have designed and built the first 3D device that can make objects invisible to heat, an advance that could transform how we protect sensitive electronics, manage heat in microchips and shield equipment from thermal detection.
Researchers have designed and built the first 3D device that can make objects invisible to heat, an advance that could transform how we protect sensitive electronics, manage heat in microchips and shield equipment from thermal detection. This story matters for Science & Discovery readers tracking mech. Reported by phys.org. Read the full original at the source link below.
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